详细介绍：

Special Features

• Minimal position changes due to curing time and temperature change allowing for even submicron order adhesion.

  * Shrinkage rate during curing is very small (less than 3%)
  * Thermal expansion coefficient is small (less than 4×10^-5/°C)

• AT9290F is transparent upon curing.

 

Specifications

Model# [Main ingredient]	Curing conditions [irradiation level & time]	Curing Shrinkage Rate (%)	Viscosity (cP)	Glass transition temperature Tg (°C)	Thermal Expansion Coefficient (10-5/°C	Bond Strength (kgf/cm2)	Special Features
AT4291A [Epoxy](*1)	50mW/cm2 10min	2~3	>20,000	205	2	>116	Small curing shrinkage rate Small thermal expansion coefficient rate
AT9290F [Epoxy](*1)	50mW/cm2 10min	1~2	>20,000	140	4	>200	Small curing shrinkage rate Small thermal expansion coefficient rateLarge curing depth
GA800E2 [Epoxy]	50mW/cm2 10min	2	>20,000	118	4.5	>136	Small curing shrinkage rate Small thermal expansion coefficient rate

*1 :	Content product is "Non-medical use, deleterious substance" (Please refer to MSDS for handling.)